As we are exploring opportunities for our PicoP scanning technology to be used in next-generation sensing applications, our Director of Systems Engineering & Advanced Applications, Jari Honkanen, took a trip out to Asia to participate in the MEMS & Sensors Industry Group (MSIG) Conference Asia 2016.
Held on September 13-14, 2016 in Shanghai, the MSIG conference was an opportunity for MicroVision to join the conversation about near- and long-term opportunities for MEMS and sensors in the Internet of Things under the theme of TSensors. This vision foresees the future being revolutionized by a trillion connected sensors – pretty cool!
Jari was invited to speak at the event, where he presented a tutorial on 3D sensing and how our PicoP® scanning technology, a MEMS-based Laser Scanning Platform, can act as a sensor for next-generation 3D depth sensing applications. There were over 100 attendees from the MEMS and sensors industry at the event. Our topic was unique among the other speakers, and based on the questions Jari fielded, it piqued the interest of many attendees.
Here is the full presentation: